Option |
Coater |
Developer |
- AD(adhesion) bake. |
- CCSS or LCSS system |
- RRC & PR pump share function(2nozzle/1pump) |
- Swing dispens, VCD for glass process |
Common |
- THC / TCU / FFU / Bar-cod / VCD & Aligner(Glass sub.) / Add Bake unit (3set) / Spin unit Max. 4set |
Utility Spec |
Power |
Power |
Phase |
Ampare |
Conn. Type |
AC220 |
φ1 |
50A |
|
|
Pressure |
Usage |
Fitting Tupe |
AIR Tube |
Air(CDA) |
5Kgf /㎠ |
150L/min |
Swg 3/8" |
SUS or PFA |
Vacuum |
≥600mmHg |
100L |
Swg 3/8" |
SUS or PFA |
N2 |
1.5Kgf /㎠ |
100L/min |
Swg 3/8" |
SUS or PFA |
DI Water |
1.5Kgf /㎠ |
3L/min |
Swg 3/8" |
SUS or PFA |
PCW |
1.5Kgf /㎠ |
20L/min |
Swg 3/8" |
SUS or PFA |
Exhaust |
Exh. volume |
Type |
Duct Size |
Duct Material |
2.8㎥ |
Heat |
Φ100X2ea |
AL or SUS |
2.8㎥ |
Alkali |
Φ100X2ea |
PVC |
2.8㎥ |
Organic |
Φ100X2ea |
AL or SUS |
Uniformity |
Process Test |
2 inch Sapphier wafer (Coating) |
Uniformity (%) |
(Max-min)/(Max+min) x 100 |
Coating Spec. |
Within a wafer |
≤ 3.0 % |
Wafer to wafer |
≤ 3.0 % |
Raw data |
Max(average data) |
20480 Å |
min(average data) |
20132 Å |
Uniformity |
Wafer to wafer |
0.63% |