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Home > Á¦Ç°¼Ò°³ >MSX 1000
 

Application

+ PR Coat & Bake
+ Develop & Bake
+ PR Coat & Develop
+ Spin Scrub & Bake
+ PIQ Process
+ SOG Process
   
 
Features


MSX1000 is designed for semiconductor and/or it's related fabrication process. It's named Modular Spin system that can be applicable for 2" up to 6" wafer, MEMS, LD, OLED process. MSX1000 spin process system provides various process adaptability, flexibility and high performances for major characteristics of spin system such as coat/ develop uniformity, RPM/ACCEL reliability as well as bake temp uniformity, robot handling reliability.
Major benefits of MSX1000 is ;
    + High Coating/Develop Performances
    + Small Foot Prints
    + Low Cost of Ownership and Running
    + Easy Operation & Maintenance guided by Intelligent Software
    + (GUI, Touch Functions on Windows 2000NT)
    + Simple Wafer Size Conversion (Automated)
    + Bar Code and USB connection for SPC
    + Programmable EBR, Back Rinse as well as Bowl Rinse.

 
 General Specification

    + Coating Uniformity: <1.0%
    + Spin RPM: 0 ~ 7000 rpm, Accuracy < ¡¾1.0 rpm
    + Acceleration: 50,000rpm/sec
    + Temp Range:???H.P- 50 ~150 ¡É ¡¾0.3 C, 150 ~ 200¡É ¡¾1.5 ¡É,
                      201 ~ 250 ¡É ¡¾2.5¡É, C.P 17 ~ 30 ¡É ¡¾0.3 ¡É
    + Throughput: >60 wafers, depend upon process
     + Dimensions: W1550 x D1250 x H2000mm